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Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backsi... अधिक

This fourth volume of the landmark handbook focuses on the design, testing and thermal management of 3D-integrated devices, both from a technological and a materials science perspective. Edited and authored by key figures from top research institutions and high-tech companies, the first part of the... अधिक